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您当前所在位置: 首页> 文献列表> 低溴环氧/氰酸酯树脂共固化反应及其层压板性能的研究
2004, 06, 756-761
低溴环氧/氰酸酯树脂共固化反应及其层压板性能的研究
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摘要:

用差示扫描量热仪(DSC)、傅立叶交换红外光谱(FT-IR)对不同配比的低溴环氧/氰酸酯树脂的共固化反应机理以及固化物的结构特征进行了研究,同时测定和讨论了其层压板的耐热性和介电性能等。研究结果表明,在低溴环氧/氰酸酯树脂的固化体系中,氰酸酯和环氧树脂通过两种途径反应最终生成噁唑烷酮结构;固化反应温度与体系的组成有关,体系中低溴环氧树脂减少固化反应温度降低;加入催化剂能明显促进体系共固化反应,同时也降低了层压板的耐热性和介电性能。在性能方面,低溴环氧树脂中加入氰酸酯使共固化物耐热性增加、Tg 升高,但氰酸酯用量增加到一定范围后,低溴环氧树脂/氰酸酯配比对 Tg 影响不大;低溴环氧树脂/氰酸酯层压板的耐热性和介电性能在一定实验范围内随着氰酸酯用量的增加明显提高。

Abstract:

The co-curing behavior and structure of co-curing product of different low brominated epoxy/cyanate ratio were studied by DSC and FTIR, and the properties of their laminates were also discussed. Result shows that oxazolinone is produceel by two approachs in the system of low brominated epoxy/cyanate. The co-curing of the low brominated epoxy resin modified by adding cyanate undergoes three stages: Firstly, the triazine is reacted by trimerization of cyanate; Secondly, the trimer and cyanate respectively react with epoxy group to produce isocyanurate and oxazoline, and oxazoline transforms into oxazolinone; Finally, isocyanurate reacts with excessive epoxy group to produce oxazolinone. Curing temperature is related with the ingredients of the system, and it becomes lower with decreasing content of epoxy resin. The addition of Cu(AcAc)2 can accelerate co-curing reation, decrease the co-curing temperature, the properties of thermo-stability and dielectric property. The addition of cyanate resin can enhance glass transition temperature(Tg) of the co-curing resin, but different ratio of low brominated epoxy/cyanate has no significant effent on Tg under certain range of the resin ratios. Thermo-stability and dielectric properties of laminate are improved with increasing content of cyanate.

参考文献

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中图分类号:TQ320

引用信息:

[1]闫红强,纪丽,戚国荣.低溴环氧/氰酸酯树脂共固化反应及其层压板性能的研究[J],2004(06):756-761.

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