尹辉斌¹,高学农²,张正国²

• 1:东莞理工学院 广东省分布式能源系统重点实验室，广东 东莞 523808
• 2:华南理工大学 化学与化工学院，广东 广州 510640

摘要(Abstract)：

相变温控是利用相变材料的相变过程以实现对物体温度控制的方法。以高热导率和储热密度的膨胀石墨/石蜡复合材料制作储热材料器件，构建了基于相变温控的电子器件散热模拟实验系统。研究在3种波动热负荷条件下，模拟芯片的表面温度随时间的变化情况，并与同型号传统散热器比较，分析相变温控对电子器件瞬态热管理的影响规律。实验结果表明，在同等条件下，相变温控散热实验系统的抗热冲击性能约为传统散热系统的1.4倍。将复合相变材料应用于电子器件的瞬态热管理中，可以降低电子设备的表面温度、减小温度波动幅度，保证电子电器设备运行的可靠性和稳定性。

关键词(KeyWords)： 相变温控;相变材料;瞬态热管理;电子散热

Abstract:

Keywords:

基金项目(Foundation): 广东省自然科学基金（2015A030313653）；广东省高校特色创新项目（2014KTSCX182）；国家自然科学基金（51106187）。

作者(Author): 尹辉斌¹,高学农²,张正国²

DOI: 10.3969/j.issn.1003-9015.2017.00.023

参考文献(References)：

• [1] XU Chao (徐超), HE Ya-ling (何雅玲), YANG Wei-wei (杨卫卫), et al. Modern research about electronic cooling method (现代电子器件冷却方法研究动态)[J]. Refrigeration and Air-Conditioning (制冷与空调), 2003, 3(4): 10-13.
  [2] Fok S C, Shen W, Tan F L. Cooling of portable hand-held electronic devices using phase change materials in finned heat sinks[J]. International Journal of Thermal Sciences, 2010, 49(1): 109-117.
  [3] Kandasamy R, Wang X Q, Mujumdar A S. Transient cooling of electronics using phase change material (PCM)-based heat sinks[J]. Applied Thermal Engineering, 2008, 28(8-9): 1047-57.
  [4] Jaworski M. Thermal performance of heat spreader for electronics cooling with incorporated phase change material[J]. Applied Thermal Engineering, 2012, 35(1): 212-219.
  [5] ZHOU Wei (周伟), ZHANG Fang (张芳), WANG Xiao-qun (王小群). Prospect of thermal control phase change in electronic devices (相变温控在电子设备上的应用研究进展)[J]. Chinese Journal of Electron Devices (电子器件), 2007, 30(1): 344-348.
  [6] PAN Ai-gang (潘艾刚), WANG Jun-biao (王俊彪), ZHANG Xian-jie (张贤杰). A review on development and applications of metal phase change technology in thermal control for aeronautics (相变温控技术在航天热控领域中的应用现状及展望)[J]. Materials Review (材料导报), 2013, 27(12): 113-119.
  [7] Pal D, Joshi Y K. Application of phase change materials to thermal control of electronic modules: a computational study[J]. Journal of Electronic Packaging, 1997, 119(1): 40-50.
  [8] Tan F L, Tso C P. Cooling of mobile electronic devices using phase change materials[J]. Applied Thermal Engineering, 2004, 24(2-3): 159-169.
  [9] Kandasamy R, Wang X, Mujumdar A S. Application of phase change materials in thermal management of electronics[J]. Applied Thermal Engineering, 2007, 27(17-18): 2822-2832.
  [10] GAO Xue-nong (高学农), LIU Xin (刘欣), SUN Tao (孙滔), et al. Research on the thermal management performance of electronic chip with composite phase change material (基于复合相变材料的电子芯片热管理性能研究)[J]. Journal of Chemical Engineering of Chinese Universities (高校化学工程学报), 2013, 27(2): 187-192.
  [11] ZHANG Zuo-guang (张佐光). Functional composite materials (功能复合材料)[M]. Beijing (北京): Chemical Industry Press (化学工业出版社), 2004.
  [12] Wu W, Zhang G, Ke X, et al. Preparation and thermal conductivity enhancement of composite phase change materials for electronic thermal management[J]. Energy Conversion and Management, 2015, 101(1): 278-284.
  [13] YIN Hui-bin (尹辉斌), GAO Xue-nong (高学农), DING Jing (丁静), et al. Preparation and thermal properties of thermal adaptation composite materials (热适应复合相变材料的制备与热性能)[J]. Acta Energiae Solaris Sinica (太阳能学报), 2011, 32(9): 1424-1430.